Active vents for cooling of computing device

ABSTRACT

Apparatus and methods of cooling a computing device using active air vents. Embodiments include active air vents capable of dynamically changing the pattern of inlet airflow into the housing of the computing device and selectively directing airflow to cool heat-generating components on need basis. Embodiments include active vents coupled to an actuation mechanism to preferentially open and close the active air vents so that inlet airflow into the housing can be regulated based on the cooling requirement of heat-generating components in the housing. Embodiments also include a control module to determine the cooling requirement of the components of the device.

FIELD

Embodiments of the present invention relate to cooling of computing devices. More particularly, embodiments relate to active vents for cooling of computing devices.

BACKGROUND

Mobile computing devices such as laptop computers, nettops, mobile internet devices (MID), personal digital assistant (PDA) and smartphones are popular among consumers who demand mobile computing and internet connectivity. These devices are designed with ever powerful electronic components within a smaller and slimmer casing to appeal consumers. On the other hand, electronic components generate heat and need to be cooled so that the device can operate at optimum temperature range. Efficient cooling is even more critical for mobile computing devices to avoid a user from feeling the uncomfortable heat from the device casing during physical contact with the devices.

Computing devices such as laptop computers utilize a cooling fan and/or a heat sink to cool electronic components within the casing with air. Cooling fan assists air ventilation by creating a negative pressure gradient in the casing relative to the ambient. The casing generally has multiple air vents to allow ambient cool air being drawn into the casing to cool the electronic components as well as to allow hot air to leave the casing. Air vents are designed at strategic locations on the casing where adjacent electronic components are expected to generate significant heat and require cooling. Typically, these air vents remain always open to entrain ambient air regardless whether the adjacent electronic components require cooling.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention are illustrated by way of example and not limited in the figures of the accompanying drawings, in which like references indicate similar elements.

FIG. 1 is a perspective view of the bottom side of an embodiment of a computing device;

FIG. 2 is a cut plane showing the inside of a computing device according to an embodiment;

FIG. 3 is a top view of an inlet air vent according to an embodiment;

FIG. 4 is a top view of a cover member according to an embodiment;

FIG. 5 and FIG. 6 are side views of a cover member aligned to an inlet air vent according to an embodiment;

FIG. 7 is a top view of an inlet air vent according to another embodiment;

FIG. 8 is a top view of a cover member according to another embodiment;

FIG. 9 and FIG. 10 are top views of a cover member aligned to an inlet air vent according to another embodiment;

FIG. 11 and FIG. 12 are side views of a passive actuation mechanism to regulate inlet airflow into a housing of a computing device according to an embodiment;

FIG. 13 is a block diagram of a computing device cooling system based on active air vents according to an embodiment;

FIGS. 14-16 are side views of active air vents selectively directing inlet airflow into a housing of a computing device according to an embodiment;

DETAILED DESCRIPTION

Embodiments of the present invention are directed to an apparatus and a method of cooling a computing device. Embodiments include a device housing having active air vents to entrain inlet air from the ambient into the housing. The air vents are active in that cover members paired to the air vents preferentially open and close the air vents to regulate the inlet airflow into the housing based on the cooling requirement of heat-generating components within the housing. Embodiments include an actuation mechanism to position the cover members relative to the air vents. Embodiments also include a control module to determine the cooling requirement of the components of the device. By controlling the degree of opening of the air vents, the flow pattern of inlet airflow into the housing is dynamically altered. Inlet airflow can therefore be selectively directed to cool the heat-generating components on need basis.

FIG. 1 is a perspective view of the bottom side of an embodiment of computing device 100. For an embodiment, computing device 100 is a notebook computer (laptop). However, other electronic devices such as netbooks, personal digital assistants (PDA), smart phones as well as other computing systems such as desktop computers, servers, set-top boxes are not precluded. For an embodiment, computing device 100 includes housing 110, fan inlet vent 120 and memory inlet vent 130. For an embodiment, both fan inlet vent 120 and memory inlet vent 130 are formed at the bottom skin 140 of housing 110. Inlet vents 120, 130 can also be formed at locations on housing 110 other than that depicted in FIG. 1, for example on the sides 150 of housing 110. For another embodiment, computing device 100 includes additional air vents for drawing inlet air into housing 110 as well as purging air within housing 110 to the ambient.

FIG. 2 is a top view of an embodiment of computing device 100. For an embodiment, computing device 100 is a laptop computer having motherboard 205 disposed within housing 110. For an embodiment, a plurality of electronic components and semiconductor chips are connected to motherboard 205. For an embodiment, a first set of heat-generating components is located adjacent to first inlet air vent 230. For an embodiment, the first set of heat-generating components includes central processing unit (CPU) 210 and graphics memory controller hub (GMCH) 220. For an embodiment, CPU 210 and GMCH 220 are thermally coupled to heat pipe remote heat exchanger (RHE) 215. For an embodiment, motherboard 205 includes a second set of heat-generating components such as random access memory (RAM) 225, wireless LAN card 260 and I/O controller hub (ICH) 235. The second set of heat-generating components is located adjacent to second inlet air vent 240. For embodiment, housing 110 also includes third inlet air vent 250 and a third set of heat-generating components is disposed adjacent to inlet air vent 250. The third set of heat-generating components may include heat-generating parts such as hard drive 255 and power supply unit 265. Other heat-generating parts such as optical drives, PC cards, and electronic components such as diodes, capacitors and transistors, may be included in either the first, second or third heat-generating components depending on the layout and design of motherboard 205. For an embodiment, inlet air vents 230, 240, 250 are formed as part of housing 110.

The term “adjacent” used in the specification denotes proximity. When a component is described to be adjacent to an inlet air vent, it is to be understood that the component is in a location within housing 110 where the inlet airflow from the adjacent inlet air vent is capable of removing heat generated by the component and cooling the component. It is also to be understood that components do not necessarily need to be on the same plane with the adjacent inlet air vent. Components can be disposed above or below the inlet air vent.

Still referring to FIG. 2, first inlet air vent 230, second inlet air vent 240 and third inlet air vent 250 are on different sides of housing 110 according to an embodiment. For another embodiment, inlet air vents 230, 240, 250 are not precluded to be formed at other locations of housing 110 such as on bottom skin 140 of housing 110 or having two or more inlet air vents formed on a particular side or on bottom skin 140 of housing 110. For an embodiment, housing 110 also includes outlet air vent 270 to allow hot air within housing 110 to escape to the ambient. For an embodiment, fan 290 is disposed on CPU 210 to dissipate away heat generated by CPU 210. Fan 290 also creates a negative pressure gradient within housing 110 relative to the ambient so that cool inlet air 275 is drawn into housing 110 via inlet air vents 230, 240, 250 and hot outlet air 280 is purged from housing 110 via outlet air vent 270 according to an embodiment.

For an embodiment, inlet air vents 230, 240, 250 each includes a plurality of through openings and is paired to respective cover members 285. Inlet air vents 230, 240, 250, together with respective cover members 285, regulate inlet airflow 275 into housing 110. It is to be understood that pairing of air vents 230, 240, 250 with respective cover members 285 includes but is not limited to positioning cover members 285 adjacent to the respective air vents 230, 240, 250 such that the extent of opening of air vents 230, 240, 250 not covered by respective cover member 285 regulates the amount of inlet airflow 275 into housing 110. For an embodiment, cover members 285 are mechanically coupled with respective air vents 230, 240, 250. For another embodiment, cover members 285 are not mechanically coupled to respective air vents 230, 240, 250.

There are different mechanisms through which cover members 285 paired to respective air vents 230, 240, 250 can regulate the inlet airflow 275 into housing 110. For an embodiment, cover members 285 can slide against and relative to the respective air vents 230, 240, 250. FIG. 3 is a top view of an air vent 230, 240, 250 according to an embodiment. For an embodiment, air vents 230, 240, 250 each includes a plurality of through openings 310. For an embodiment, air vents 230, 240, 250 have common design and dimensions. However, for other embodiments, air vents 230, 240, 250 are not precluded from having different designs or dimensions. For an embodiment, air vents 230, 240, 250 are fabricated as part of housing 110. For another embodiment, air vents 230, 240, 250 are assembled with housing 110 and are detachable from housing 110. For other embodiments, through openings 310 can have different geometrical shapes and configurations. FIG. 4 is a top view of cover member 285 according to an embodiment. For an embodiment, cover member 285 includes a plurality of through openings 320 defined by a plurality of partition members 330. For an embodiment, the shape, dimension and number of partition members 330 of cover members 285 match through openings 310 of respective air vents 230, 240, 250 of which cover members 285 are paired to.

Turning now to FIG. 5, FIG. 5 is a side view of cover member 285 paired to an air vent 230, 240, 250 according to an embodiment. For an embodiment, cover member 285 is positioned relative to respective air vent 230, 240, 250 such that through openings 320 of cover member 285 are aligned with through openings 310 of respective air vents 230, 240, 250 to form a plurality of through passages. Such alignment allows maximum inlet airflow 275 through air vents 230, 240, 250 into housing 110. FIG. 6 is a side view of another position of cover member 285 relative to air vent 230, 240, 250 according to an embodiment of the invention. For an embodiment, partition members 330 of cover members 285 are aligned against through openings 310 of air vents 230, 240, 250 such that partition members 330 completely shut through openings 310. Such configuration completely obstructs inlet airflow from passing through air vents 230, 240, 250 and entering housing 110. Partial inlet airflow into housing 110 can be obtained by aligning partition members 330 against through openings 310 such that air vents 230, 240, 250 are partially open. For another embodiment, cover member 285 can be any structure capable of shutting through openings 310 of air vents 230, 240, 250. For an embodiment, cover member 285 does not have through openings 320 and is a structure with a planar surface. For various embodiments, cover members 285 can be positioned relative to respective air vents 230, 240, 250 to vary the size of through openings 310 of air vents 230, 240, 250 through which inlet airflow 275 can pass. As such, the amount of inlet airflow 275 passing through air vents 230, 240, 250 can be regulated.

Various embodiments of cover member 285 and inlet air vents 230, 240, 250 may exist without departing from the spirit and intent of the invention. Embodiments may include different design, configuration and orientation of cover member 285 with respect to inlet air vents 230, 240, 250. FIG. 7 is a top view of inlet air vent 500 according to an embodiment of the invention. For an embodiment, inlet air vent 500 includes a plurality of through openings 510 arranged in a radial configuration. FIG. 8 is a top view of cover member 520 according to an embodiment and is capable of pairing with inlet air vent 500. Cover member 520 includes a plurality of through openings 530 defined by planar surface 540. For an embodiment, the shape, orientation, dimensions and the number of through openings 530 are identical with through openings 510 of inlet air vent 500. However, through openings 510 of inlet air vent 500 are not precluded from having different shape, orientation, dimensions or count from through openings 530 of cover member 520 for other embodiments. FIG. 9 is a top view of an embodiment of cover member 520 aligned with an embodiment of inlet air vent 500. Through openings 530 of cover member 520 can be aligned with through openings 510 of inlet air vent 500 to form a through passage between cover member 520 and air vent 500. The through passage allows inlet airflow 275 from the ambient to enter housing 110. For an embodiment, cover member 520 can be engagably displaced relative to air vent 500 such that planar surface 540 is either fully or partially covering through openings 510 of air vent 500. FIG. 10 is a top view of an embodiment of cover member 520 aligned with air vent 500 and completely covering through openings 510 of air vent 500. For an embodiment, cover member 520 can be engagably displaced relative to air vent 500 by way of rotating cover member 520. Other embodiments capable of varying the size of through openings 510 of air vent 500 are also possible.

Embodiments of the invention include an actuation mechanism configured to engagably displace cover members 285. For an embodiment, cover members 285 are coupled to an actuation mechanism to regulate the amount of inlet airflow 275 entering housing 110. For an embodiment, the actuation mechanism actuates cover members 285 relative to respective inlet air vents 230, 240, 250 to vary the size of through openings 310, 510 of inlet air vents 230, 240, 250 available for inlet airflow to pass through. For an embodiment, cover members 285 are coupled to a magnetic solenoid system adapted to drive cover members 285 to fully open, fully shut and partially open through openings 310, 510. For an embodiment, the magnetic solenoid system includes two sets of magnetic solenoids. For an embodiment, each set of magnetic solenoids includes one or more solenoids. For an embodiment, when a first set of solenoids is actuated, for example when current flows through the windings of the solenoid, cover members 285 are pulled to one side. For an embodiment, through openings 320 of cover members 285 are lined up with through openings 310 of inlet air vents 230, 240, 250 (see FIG. 5). Actuation of a second set of solenoids pulls cover members 285 in an opposite direction such that through openings 310 are closed or partially open. For another embodiment, cover members 285 are coupled to a linear motor to vary the size of through openings 310, 510.

Embodiments of the actuation mechanism to drive the opening and shutting of inlet air vents 230, 240, 250 described above include active actuation mechanism. However, embodiments of the invention do not preclude passive actuation mechanism from being adopted to regulate the amount of inlet airflow 275 into housing 110. For an embodiment, the actuation mechanism to drive cover member 285 to fully shut, fully open and partially open through openings 310 of inlet air vents 230, 240, 250 is inherent in cover member 285. FIG. 11 and FIG. 12 are side views of an embodiment of passive actuation mechanism to regulate inlet airflow 275 into housing 110. Referring to FIG. 11, cover members 285 can be aligned to fully shut through openings 310 of inlet air vents 230, 240, 250. For an embodiment, cover members 285 are capable of changing the size and/or shape of cover members 285 as a function of temperature. For example and according to an embodiment, cover members 285 may bend to yield a concave or convex structure when heated. Referring to FIG. 12 and according to an embodiment, cover members 285 bend upwards (away from inlet air vents 230, 240, 250) and cause through openings 310 available for inlet airflow 275 to enter housing 110 via inlet air vents 230, 240, 250. For an embodiment, the degree of curvature of cover member 285 is dependant on the temperature within housing 110. The higher the temperature within housing 110, cover members 285 bend to a greater extent and thus allow greater amount of inlet airflow 275 to enter housing 110. When the temperature within housing 110 drops, cover members 285 bend less and reduce the size of through openings 310 available for inlet airflow 275 to pass through. For an embodiment, cover members 285 is made of shape memory alloy (SMA) materials. Shape memory alloy materials can deform under the excitation of temperature or an electric field but will return to the original shape once the means of excitation is withdrawn. For an embodiment, cover members 285 is a bimetallic strip. Examples of bimetallic strip material may include copper on one part of the strip and aluminum on the other part of the strip or any combination of two metallic materials with different coefficients of thermal expansion.

Embodiments of the invention include a control module to determine the respective cooling requirement of heat generating components within housing 110. FIG. 13 is a block diagram of control module 920 to regulate the amount of inlet airflow 275 passing through inlet air vents 230, 240, 250. For an embodiment, control module 920 includes an operating system of computing device 100. For an embodiment, control module 920 includes a thermal management system. For an embodiment, control module 920 determines cooling requirement 910 of heat-generating components in computing device 100. For an embodiment, cooling requirement 910 of heat-generating components includes temperature-state inputs, or power-state inputs, or both temperature-state and power-state inputs obtained from heat-generating components. For an embodiment, the temperature or power-state inputs are gathered by way of thermal sensors or thermal diodes sensing the gate or junction temperatures of heat-generating components. For an embodiment, control module 920 also includes an embedded controller having an algorithm executable to alter the Basic Input/Output System (BIOS) of the operating system. For an embodiment, the embedded controller is capable of determining whether cooling of heat-generating components in computing device 100 is required. According to an embodiment, control module 920 controls actuation mechanism 930 based on cooling requirement 910 of heat-generating components. For an embodiment, control module 920 sends signals to actuation mechanism 930 to regulate the amount of inlet airflow 275 via active vents 940. For an embodiment, actuation mechanism 930 selectively directs inlet airflow 275 into housing 110 via each of active vents based on cooling requirement 910 of heat-generating components.

When computing device 100 is in operating mode, heat-generating components in housing 110 may require different cooling requirement 910. For an embodiment, an optimal pattern of inlet airflow 275 entering housing 110 is desired by selectively directing inlet airflow 275 to heat-generating components requiring cooling. FIG. 14 to FIG. 16 are side views of an embodiment selectively directing inlet airflow 275 into housing 110. Embodiments include motherboard 205 disposed within housing 110. A plurality of heat-generating components such as CPU 210, RAM 225 and hard drive 255 are disposed within housing 110. For an embodiment, CPU 210, RAM 225 and hard drive 255 are respectively disposed adjacent to first vent 230, second vent 240 and third air vent 250. For an embodiment, inlet air vents 230, 240, 250 each has a plurality of through openings 310 and is paired with cover member 285. For an embodiment, cover members 285 are configured to regulate inlet airflow 275 into housing 110 by varying the size of through openings 310 of inlet air vents 230, 240, 250. For an embodiment, cover members 285 are operatively coupled to actuation mechanism 930 configured to cause cover members 285 to fully open, fully shut or partially open through openings 310 of inlet air vents 230, 240, 250. For an embodiment, fan 290 is included in housing 110 to create a negative pressure gradient in housing 110 relative to the ambient. The negative pressure gradient within housing 110 enables an evacuative airflow to flow from the ambient into housing 110. The evacuative airflow allows cool air from the ambient to replace hot air inside housing 110 and thus cools heat-generating components.

Referring to FIG. 14, FIG. 14 is an embodiment having all inlet air vents 230, 240, 250 open for inlet airflow 275 to pass through and enter housing 110 to cool heat-generating components. There are scenarios when major components such as CPU 210, RAM 225 and hard drive 255 are equally stressed and require simultaneous cooling. An example of such scenario is when computing device 100 is running a multi-tasking of applications such as backing up contents of a compact disc (CD) media, 3D gaming and heavy computing load on CPU 210 and RAM 225. For an embodiment, cooling requirement 910 of each heat-generating component is determined and fed to control module 920. For an embodiment, control module 920 sends signal to actuation mechanism 930 and causes cover members 285 to fully open through openings 310. As such, inlet airflows 275 are channeled to cool components requiring cooling.

Turning now to FIG. 15, FIG. 15 is an embodiment capable of dynamically changing the pattern of inlet airflow 275 entering housing 110. There are instances when CPU 210 is running at low power but other components such as RAM 225 and GMCH 220 are running with relatively higher load and thus generate more heat, for example downloading from media-rich contents from the internet. For an embodiment, cooling of CPU 210 and hard drive 255 is not required as much as other components such as RAM 225 and GMCH 220. As such, higher entrainment of inlet airflow 275 to cool RAM 225 and GMCH 220 is desired. For an embodiment, member covers 285 for first vent 230 and third vent 250 are positioned to fully close through openings 310 and inlet airflow 275 being selectively directed to enter housing 110 via second vent 240 to cool GMCH 225. In other instances, cover members 285 can be positioned to partially open through openings 310 of air vents based on cooling requirement 910 of particular components. FIG. 16 is an embodiment where cover members 285 of second vent 240 and third vent are kept partially open. Various scenarios concerning different computing load on components of computing device 100 other than those described above may be contemplated. For each scenario, flow pattern of inlet airflow 275 into housing 110 can be dynamically changed to match different cooling requirement of heat-generating components.

In the foregoing specification, reference has been made to specific embodiments of the invention. It will, however be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than restrictive sense. 

1. An apparatus, comprising: a housing of a computing device having at least a first and a second vent, said vents each having a plurality of through openings; a first set of heat-generating components disposed within the housing and adjacent to the first vent; a second set of heat-generating components disposed within the housing and adjacent to the second vent; a plurality of cover members, each being paired to said vents and being configured to regulate airflow into the housing via the through openings of said vents; and an actuation mechanism being configured to engagably displace the plurality of cover members.
 2. The apparatus of claim 1, further comprising a control module to determine a cooling requirement of the first and second sets of heat-generating components and to control the actuation mechanism based on the cooling requirement.
 3. The apparatus of claim 2, wherein the control module determines the cooling requirement based on temperature-state inputs, or power-state inputs, or a combination of temperature-state and power-state inputs of the first and second heat-generating components.
 4. The apparatus of claim 1, wherein the actuation mechanism includes one of a magnetic solenoid or a linear motor, and is being coupled to the plurality of cover members.
 5. The apparatus of claim 4, wherein each of the plurality of cover members includes a plurality of through openings.
 6. The apparatus of claim 1, wherein the plurality of cover members is capable of varying the size of the through openings of said vents available for inlet airflow to pass.
 7. The apparatus of claim 6, wherein the plurality of cover members is made of shape memory alloy (SMA).
 8. The apparatus of claim 6, wherein the plurality of cover members is a bimetallic strip made of materials with different coefficients of thermal expansion.
 9. An assembly, comprising: a housing of a computing device having at least a first and a second vent, said vents being capable of drawing an inlet airflow through a plurality of through openings of said vents to cool a plurality of heat-generating components disposed within the housing; a plurality of cover members disposed adjacent to said vents, the cover members being configured to regulate the inlet airflow passing through the through openings; an actuation mechanism operatively coupled to the plurality of cover members to cause the cover members to fully open, fully shut or partially open said vents; and a control module operatively connected to an operating system of the computing device and a thermal management system, the control module being configured to determine a cooling requirement for each of the heat-generating components and to activate the actuation mechanism to selectively direct the inlet airflow to cool the heat generating components.
 10. The assembly of claim 10, further comprising a fan adapted to create an evacuative airflow having a negative pressure gradient within the housing relative to the ambient air.
 11. The assembly of claim 11, wherein the control module includes an embedded controller capable of altering the BIOS of the computing device.
 12. The assembly of claim 12, wherein the actuation mechanism includes a magnetic solenoid system or a linear motor.
 13. The assembly of claim 10, wherein the plurality of cover members is capable of varying the size of the through openings of said vents available for inlet airflow to pass.
 14. The assembly of claim 14, wherein the plurality of cover members is made of one of shape memory alloy (SMA) and bimetallic material, wherein the bimetallic material includes materials with different coefficients of thermal expansion.
 15. A method, comprising: disposing at least a first and a second set of heat-generating components in a housing of a computing device, the housing having at least a first vent adjacent to the first set of heat-generating components and a second vent adjacent to the second set of heat-generating components, wherein said vents each includes a plurality of through openings; determining a cooling requirement for each of the first and second sets of heat-generating components; causing a plurality of cover members to fully open, fully shut or partially open said vents based on the cooling requirement; and selectively directing airflow passing through the through openings of said vents to cool the heat-generating components.
 16. The method of claim 16, further comprising aligning a plurality of through openings disposed on the cover members against the through openings of said vents.
 17. The method of claim 16, wherein causing the cover members to fully open, fully shut or partially open said vents includes changing the shape, size or configuration of the cover members.
 18. The method of claim 18, wherein the plurality of cover members is made of shape memory alloy (SMA) or a bimetallic material, wherein the bimetallic material includes materials with different coefficients of thermal expansion. 